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TYPE SMV0603ERR MODEL CITATION SUBJECT DATE
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Feb. 06, 2009
Structure
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1. STRUCTURE
NO. 1.1 1.2 1.3 1.4 1.5 1.6 1.7 ITEM Main Material End termination Packaging Complies with Standard Zinc Oxide Ag/Ni/Sn Reel IEC61000-4-2 level 4 DESCRIPTION
Complies with RoHS Yes Standard Lead content < 1000ppm Reflow solder profile 250 temperature (Recommend)
L W T(max.) 1.60 0.15 0.80 0.10 0.90 0.3 0.1
1.8
Dimensions
a
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Electrical Characteristics
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2. ELECTRICAL CHARACTERISTICS
N0. 2.0 ITEM Standard Conditions Maximum Allowable Voltage Varistor Voltage Varistor Voltage Temperature Coefficient Max. Clamping Voltage ESD Trigger Voltage (VT) Response time Leakage current Capacitance AC : *(1) Vrms DC : *(1) V V0.1mA : *(1) V 0 ~ -0.05 %/C *(1) V at 1 A
<*(1)V Trise < 1 nS ILDC ILDCA
PERFORMANCE
2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8
TEST METHODS Unless otherwise specified, all tests are made under environmental conditions as given below: Temperature: 5~35C Relative humidity: 45~85 % RH Maximum continuous sine wave(RMS) or DC voltage which may be applied. Voltage across the varistor measured at CmA DC.
Peak voltage across the varistor with a specified peak impulse current of 8x20s waveform.
<*(1) <*(1)A
*(1) pF.
at V1mAx80% at V1mAx80% (After ESD Test) Capacitance shall be measured at 1 MHz,1 Vrms max. 0V bias and 202
*(1) See table 2.1 Electrical Characteristics
TYPE SMV0603ERR MODEL CITATION SUBJECT Electrical Characteristics DATE REV.
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C01
Table 2.1 Electrical Characteristics Part Number
Symbol
Maximum Allowable Voltage
AC DC
Varistor Voltage
V1mA
Max. ESD Leakage Clamping Trigger Current Typical Capacitance Voltage Voltage (VT) (A)
V V ILDC ILDCA PF(MHz) Tolerance (%)
0603E0500R2PRR 0603E050050PRR 0603E050100NRR 0603E050220NRR 0603E050330NRR 0603E050560NRR 0603E050820NRR 0603E050101NRR 0603E120050PRR 0603E120100NRR 0603E120220NRR 0603E120330NRR 0603E120560NRR 0603E120820NRR 0603E120101NRR 0603E2400R05PR R 0603E2400R8PRR 0603E2402R0PRR 0603E2402R8PRR 0603E2402R5PRR 0603E240080NRR 0603E240100NRR 0603E240130NRR
--3.3 3.3 3.3 3.3 3.3 3.3 3.3 8 8 8 8 8 8 8 --------18 -------
5 5 5 5 5 5 5 5 12 12 12 12 12 12 12 24 24 24 24 24 24 24 24
----20~30 24~36 15~25 15~25 15~25 15~25 15~25 33~50 27~42 20~30 20~30 20~30 20~30 20~30 -----100~150 120~180 120~180 100~150 160 35.3~42.9 160
<50 55 <65 <34 <34 <36 <34 <36 <85 <60 <55 <55 <55 <55 <55 <100 200 240 240 240 <240 <72 <240
160 ----------------------------350 ---------------
0.05 1 1 1 1 0.1 1 1 1 0.1 1 1 1 1 1 0.04 0.1 0.1 0.1 0.1 0.1 0.1 0.1
10 2 2 2 2 2 2 2 2 2 2 2 2 2 2 --2 2 2 2 2 2 2
0.25 4~9 10 22 33 56 82 100 5~9 10 22 33 56 82 100 0.05 0.8~1.5 1.5~3.5 2~4.5 2~4.5 8 10 13
+50/-50 +80/-20 +30/-30 +30/-30 +30/-30 +30/-30 +30/-30 +30/-30 +80/-20 +30/-30 +30/-30 +30/-30 +30/-30 +30/-30 +30/-30 +200/-100 +80/-20 +80/-20 +80/-20 +80/-20 +30/-30 +30/-30 +30/-30
* 0603E2400R2PRR : Minimum ESD pulse withstand 2000 times
TYPE SMV0603ERR MODEL CITATION SUBJECT Reliability DATE REV.
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C01
3. ENVIRONMENTAL CHARACTERISTICS
No. 3.1
Characteristic High Temperature Storage Test method and description The specimen shall be subjected to 150 2 for 1000 12 hours in a thermostatic bath without load and then stored at room temperature and humidity for 1 to 2 hours. The change of varistor voltage shall be within 10. The temperature cycle of specified temperature shall be repeated five times and then stored at room temperature and change of varistor voltage shall be within 10and mechanical damage shall be High Temperature Load Step 1 2 3 4 Temperature -403 Room Temperature 1252 Room Temperature Period 30Min3 1~2 hours 30Min3 1~2 hours
3.2 Temperature Cycle humidity for one or two hours. The
After being continuously applied the maximum allowable voltage at 85 2 For 1000 2 hours, the specimen shall be stored at room temperature and humidity for one or two hours, the change of varistor voltage shall be within 10. The specimen should be subjected to 40 2, 90 to 95%RH environment, and the
3.3
3.4
Damp Heat Load/ Humidity Load
maximum allowable voltage applied for 1000 hours, then stored at room temperature and humidity for one or two hours. The change of varistor voltage shall be within 10%. The specimen should be subjected to -40 2, without load for 500 hours and then
3.5
Low Temperature Storage
stored at room temperature for one or two hours. The change of varistor voltage shall be within 10
4. TECHNICAL TERM
No. 4.1 4.2 4.3 Item
Operating Temperature Range Storage Temperature Range Transient Response Time
Specifications
-40 to +85 -40 to +125 < 50 ns
Description
Operating temperature range without derating. Storage temperature range without voltage applied. Time lag between application of surge and varistor's "turn-on" conduction action.
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Soldering
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5. SOLDERING RECOMMENDATIONS
5.1 Recommended solder pad layout
A
B
C
D
0.9~1.2
2.7~3.2
0.7~1.0
0.9~1.2
Unitmm
5.2 The SIR test of the solder paste shall be doneBased on JIS-Z-3284 5.3 Steel plate and foot distance printing Foot distance printing (mm) > 0.65mm 0.65mm~0.5mm 0.50mm~0.40mm <=0.40 mm Steel Plate thickness (mm) 0.18mm 0.15mm 0.12mm 0.10mm
5.4 IR Soldering Rapid heating, partial heating or rapid cooling will easily cause defect of the component. So preheating and gradual cooling process is suggested. IR soldering has the highest yields due to controlled heating rates and solder liquids times. Make sure that the element is not 2.4 The IR reflow and temperature of Soldering for Pb Free subjected to a thermal gradient steeper than 4 degrees per second. 2 degrees per second is the ideal gradient. During the soldering process, pre- heating to within 100 degrees of the solders peak temperature is essential to minimize thermal shock.
TYPE SMV0603ERR MODEL CITATION
SUBJECT Soldering
PAGE DATE
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C01
IR reflow Pb Free Process suggestion profile (1) The solder recommend is Sn96.5/Ag 3.5 of 120 to 150m (2) Ramp-up rate (217 to Peak) + 3/second max (3) Temp. maintain at 175 +/-25 180 seconds max (4) Temp. maintain above 217 60-150 seconds (5) Peak temperature range 245 +20/ -10 time within 5 of actually peak temperature (tp) 10~20 seconds (6) Ramp down rate +6 /second max. Perform adequate test in advance as the reflow temperature profile will vary according to the conditions of the manufacturing process, and the specification of the reflow furnace. 5.5 Resistance to soldering heat-High Temperature Resistance:260,10sec-3times. 5.6 Hand Soldering In hand soldering of the Varistors. Large temperature gradient between preheated the Varistors and the tip of soldering iron may cause electrical failures and mechanical damages such as crackings or breakings of the devices. The soldering shall be carefully controlled and carried out so that the temperature gradient is kept minimum with following recommended conditions for hand soldering. 5.6.1 Recommended Soldering Condition 1 1 Solder 0.12~0.18mm Thread solder (Sn96.5:Ag3.5) with soldering flux in the core. Rosin-based and non-activated flux is recommended. 2 Preheating The Varistors shall be preheated so that Temperature Gradient between the devices and the tip of soldering iron is 150 or below.
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Soldering
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3Soldering Iron Rated Power of 20w max with 3mm soldering tip in diameter. Temperature of soldering iron tip 380max,3-5sec ( The required amount of solder shall be melted in advance on the soldering tip.) 4Cooling After soldering. The Varistors shall be cooled gradually at room ambient temperature. 5.6.2 Recommended Soldering Condition 2Without preheating 1Solder iron tip shall not directly touch to ceramic dielectrics. 2Solder iron tip shall be fully preheated before soldering while soldering iron tip to the external electrode of Varistors. 5.7 Post Soldering Cleaning 5.7.1 Residues of corrosive soldering fluxes on the PC board after cleaning may greatly have influences on the electrical characteristic and the reliability (such as humidity resistance)of the Varistors which have been mounted on the board. It shall be confirmed that the characteristic and the reliability of the devices are not affected by the applied cleaning conditions. 5.7.2. When an ultrasonic cleaning is applied to the mounted Varistors on PC Boards. Following conditions are recommended for preventing failures or damages of the devices due to the large vibration energy and the resonance caused by the ultrasonic waves. 1Frequency 29MHz max 2Radiated Power 20w/lithr max 3Period 5minuets max
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Packaging Specification
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6. PACKAGING SPECIFICATION
6.1 Carrier tape and transparent cover tape should be heat-sealed to carry the products, and the reel should be used to reel the carrier tape. 6.2 The adhesion of the heat-sealed cover tape shall be 40 +20/ -15grams. 6.3 Both the head and the end portion of the taping shall be empty for reel package and SMT auto-pickup machine. And a normal paper tape shall be connected in the head of taping for the operator to handle
K0 A0 B0 Symbol 0.05 0.05 0.05
T 0.05
0.22
D0 T2 +0.10 0.05 -0.05
1.26 1.56
D1 0.05
1.00
W E P1 P2 P0 0.10 0.10 0.10 0.10 0.10
4.00 2.00 4.00 8.00 1.75
F 0.05
3.50
mm
1.10
1.90
0.95
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Reel Dimension
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7. REEL DIMENSION
E C
B D
W1 W
A
Symbol Unit(mm)
A 1781
B 600.5
C 130.2
D 210.2
E 2.00.5
W 90.5
W1 1.50.15
Standard packaging1000 pcs/Reel.

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